GMT Frankfurt London New York Sydney Tokyo
Live Quotes
Live Crypto
July 01, 2018

China Development Bank to issue 35 billion yuan bonds via ‘connect’ scheme: report

China Development Bank to issue 35 billion yuan bonds via ‘connect’ scheme: report
FILE PHOTO: A China yuan note is seen in this illustration photo May 31, 2017. REUTERS/Thomas White/Illustration/File Photo

BEIJING (Reuters) – China Development Bank is expected to issue 35 billion yuan ($5.29 billion) financial bonds to global investors on July 3 under “bond connect” scheme, China Securities Journal reported on Sunday.

The date of issue marks the one-year anniversary of the “bond connect” scheme launched to link China’s market with overseas investors.

This latest issue will include five products with maturity dates between one to ten years, the report said.

CDB has hired Bank Of China (Hong Kong), Credit Agricole (PA:CAGR) and Ping An Securities (Hong Kong) as global coordinators for the issue.

($1 = 6.6171 Chinese yuan renminbi)

Related Articles

Staff

We offer free education in forex, commodities, stock market, CFD and Cryptocurrencies by trading forecast, technical analysis, technical tools, and business news, we also offer real time quotes, live charts, market overview, market data and economic calendar.

Contact Form

Name

Email*

Message*